Features |
SPECIFICATIONS
Weight Main Board : 57g / 2.01 oz, Half-Height Bracket : 12g / 0.42 oz Dimensions Main Board: 117.4 x 121 x 21.6 mm / 4.62 x 4.76 x 0.85 inches, Half-Height Bracket: 80 x 21.6 mm / 3.15 x 0.85 inches Audio Technology SmartComms Kit Signal-to-Noise Ratio (SNR) 120 dB (DAC) Direct Mode Headphone (Stereo): PCM 16-bit, 44.1, 48.0, 88.2, 96.0. 192.0 kHz Headphone (Stereo): PCM 24-bit, 44.1, 48.0, 88.2, 96.0. 192.0 kHz Line Out (Stereo / Surround): PCM 16-bit, 44.1, 48.0, 88.2, 96.0. 192.0 kHz Line Out (Stereo / Surround): PCM 24-bit, 44.1, 48.0, 88.2, 96.0. 192.0 kHz Optical Out (Stereo)*: PCM 16-bit, 44.1, 48.0, 88.2, 96.0, 192.0 kHz PCM 24-bit, 44.1, 48.0, 88.2, 96.0, 192.0 kHz Optical Out is available with DBPro daughter board upgrade DSD Playback Headphone/Line Out (Stereo): Native DSD: DSD64, DSD128, DSD256 DoP: DSD64 ^ DSD Playback is available with DBPro daughter board upgrade Recording Resolution Mic-in (Mono): Mono, 16-bit, 44.1, 48.0, 88.2, 96.0 kHz Mic-in (Mono): Mono, 24-bit, 44.1, 48.0, 88.2, 96.0 kHz Line-in (Stereo): Stereo, 16-bit, 44.1, 48.0, 88.2, 96.0, 192.0 kHz Line-in (Stereo): Stereo, 24-bit, 44.1, 48.0, 88.2, 96.0, 192.0 kHz Connectivity Options (Main) 1 x ⅛″ Mic-in, 1 x ⅛″ Line-in, 1 x ⅛″ Headphone / Headset-out / Front-out (default as Headphone / Headset), 1 x ⅛″ Rear-out, 1 x ⅛″ Center / Sub-out Headphone Amp Supported Headphone Impedance: 32–600Ω, Output Impedance: 10Ω Max Channel Output 5.1 Channels Supported Operating Systems Windows 10, Windows 11 ASIO ASIO 2.3 DAC THD+N: ≤0.004% Recommended Usage Home Entertainment
SYSTEM REQUIREMENTS
Windows OS Intel Core i3 or AMD equivalent processor Intel, AMD, or 100% compatible motherboard Microsoft Windows 10 32 / 64-bit or higher >4 GB RAM >4 GB of free hard disk space Available PCIe slot
PACKAGE CONTENTS
Sound Blaster Audigy Fx V2 Sound Card Half-height bracket (Full height bracket mounted on board) Quick Start Leaflet Warranty Leaflets SmartComms Kit Leaflet |